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        Printed Circuit Board Assembly

        Manufacturing Process Capabilities

        • IPC J-STD-001F, IPC-A-610F Class II & III
        • Materials IQC ( C = 0 Sampling Plan )
        • SnPb and RoHS Soldering
        • Extra Large Board (630x570mm)
        • Fine Pitch Components (16 mils)
        • Micro BGA, CSP (0.5mm), 0201 chips
        • X-Ray, AOI and Digital Microscope
        • High Melting Point(HMP) soldering process
        • Conformal coating complies to Aerospace std
        • TCP ACF Bonding
        • In-Circuit Test Fixture & Software Development
        • Flying Probe Test Software
        • Labview PXI Component Test
        • Functional Tester Development
        • 2D/3D Barcode Development
        • Environment and ESS Testing
        • DFM, DFT and CAD Support
                   Click this for more : - Details




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